How to develop an industrial PC based on COM - mechanics, data transmission and cooling

Standards like COM Express exist for making customer-specific small form factor solutions. These are used to reduce the user‘s development time and costs. Is it possible to reduce the user‘s development costs even further?

This white paper describes how this can be done with a modular approach to the carrier, enclosure and cooling using pre-qualified components. The paper focuses on the implementation and qualification of high-speed data interfaces and optimization of cooling through simulation and thermal measurement.

The Computer-On-Module market is flourishing like never before. Tremendous growth rates are expected in the coming years, specifically due to implementation of the IIoT (the Industrial Internet of Things). But why is computer-on-module (COM) technology so appealing to the industrial sector? Every application is different and demands dedicated electronics for recording, processing and displaying process data as a result. Production products are often unable to meet these special requirements...

 

 


 


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