Artificial Intelligence on the Edge
This article introduces UP AI Edge, a platform which is fully powered by Intel technology and integrates: Intel Apollo Lake-I CPU, Intel Cyclone 10 gx...
This article introduces UP AI Edge, a platform which is fully powered by Intel technology and integrates: Intel Apollo Lake-I CPU, Intel Cyclone 10 gx...
The world's first cloud for any embedded display via the flatpanel controller offers full connectivity to enable central parameterization and cons...
There was a time when traditional software publishers could generate substantial revenues with simple one-off sales. As the digital market kept growin...
Cloud, Edge and Fog computing is everywhere and everybody is talking about it. In industrial surroundings traditional server approaches cannot provide...
Wednesday, November 13, 2019
This webinar explains how rugged, low latency edge device can be designed and also shows how to consolidate different functionalities to single computing devices. Some examples shown in this webinar display successful real live implementations.
What is a smart edge device? The Internet of Things and Industry 4.0 are driving high ROIs and new revenue opportunities as the use of smart edge devi...
Standards like COM Express exist for making customer-specific small form factor solutions. These are used to reduce the user‘s development time ...
Operating temperature fluctuations in medical diagnostic and analytical instrumentation equipment can significantly affect the test results and shorte...
This article explains the requirements digitalization will bring to the manufacturing industry, and how powerful COM Express modules can help to meet ...
This article describes the ARIS (Arrow Renesas IoT Synergy) development platforms, which leverage the Renesas Synergy framework and address the specif...
Users are faced with the question of how they can optimally use the latest generation of Intel Atom processors. Which module standard covers applicati...
This article takes a closer look at the challenges that SIs face with OT-to-OT, OT-to-IT, and OT-to-IIoT interoperability, as well as the solutions av...
|
|
AFINUM has invested in Garz & Fricke with headquarters in Hamburg. The main goal of the investment is to financially support further growth measur...
This article presents the advantages provided by the new TI Sitara AM572x processor integrated in the modules offered by Phytec. By Florian ...
Thermal management of medical imaging systems is more challenging than ever. Given the complexity of some PET and SPECT systems, the use of a custom d...
Industry 4.0 and the availability of technologies for collaborative robotics continuously increase the intelligence requirements in automation and rob...
The new SMARC standard 2.0 was introduced in June 2016. Besides important improvements and technical updates, it also threw open the door to the Inter...
Far away from protected server rooms or automation lines in air-conditioned production halls, embedded computers need to withstand the toughest condit...
More manufacturers of computer technology for harsh environments are expanding their hardware offerings with the right glue logic to develop IoT solut...
The latest industrial Intel Atom processors are empowering new, small form factor systems for industrial applications. IIoT hardware optimization usin...
|
|
This article reviews sensors for customer identification, presence detection and reliable note recognition in the mechanisms of intelligent vending ma...
SECO is an Italian company specialized in electronic embedded solutions since 1979. Today, after more than 38 years on the international market, and w...
This webinar is a joint event of AAEON and the IQRF Alliance – an international team of companies and institutions building up an ecosystem ...
Creating an optimized platform for the integration of I/O, BIO, memory support, mSATA and display support, among other features, is a daunting c...
This article shows that delivering truly rugged solutions requires a focused strategy beginning with R&D and ending with robust products. Reliabil...
Against the background of Industry 4.0 and the IoT, the need for secure communications and the associated networking of systems and components is incr...
Kaby Lake captured the embedded world quickly. The first board-level products were introduced in parallel to the launch of the processor family, and j...
The key to building a presence in a new market with an innovative new technology is to construct that technology on a solid foundation. To achieve tha...
This article explains how a confi gurable logic cell can simplify the implementation of complex functions on a PIC microcontroller. By Manu V...
Connecting machine vision systems to the IoT creates a powerful network capability. Being able to identify objects from cameras allows the local node ...
Designing embedded computer platforms that can cope with extremes in temperature, vibration and humidity demands a focused approach to quality. Delive...
The theme of the nVent Schroff booth at Embedded World 2019 was “Experience Expertise – Modularity, Performance, Protection and Design”. Join us as our experts give an overview of th...
Through its US subsidiary, located in Minnesota, Garz & Fricke is providing support for its growing HMI and Panel-PC business in the USA and Canada while also strengthening its presence in North A...
In a much larger stand than in previous years, at embedded world 2019 SECO showcases its wide range of solutions and services for the industrial domain and IoT. Among the main innovations, in this vid...
Since about two years Portwell is part of the Posiflex Group. Together with KIOSK, the US market leader in KIOSK systems, the Posiflex Group is a strong player in the Retail, KIOSK and Embedded market...
Florian Freund, Engineering Director DACH at Arrow Electronics talks us through Arrow’s transformation from distributor to Technology Platform Provider and how Arrow is positioned in both, Custo...
Arm’s Platform Security Architecture (PSA) has taken a step forward with the launch of PSA Certified, a scheme where independent labs will verify that IoT devices have the right level of securit...
The DIN-Rail system from MEN is a selection of individual pre-fabricated modules that can variably combine features as required for a range of embedded Rail Onboard and Rail Wayside applications. The ...
The adoption of graphics in embedded and AI applications are growing exponentially. While graphics are widely available in the market, product lifecycle, custom change and harsh operating environments...
With increasing complexity of applications, no single type of computing core can fulfill all application requirements. To optimize AI performance at the edge, an optimized solution will often employ a...
The UDE Multi-Target Debug Solution from PLS provides synchronous debugging of AURIX multi-chip systems. A special adapter handles the communication between two MCUs and the UAD3+ access device and pr...
To meet all requirement of vertical applications, ADLINK’s Smart Panel is engineered for flexible configuration and expansion to reduce R&D time and effort and accelerate time to market. The...
Morten Kreiberg-Block, Director of Supplier & Technology Marketing EMEA at Arrow Electronics talks about the power of AI and enabling platforms. Morten shares some examples of traditional designin...
Andrew Bickley, Director IoT EMEA at Arrow Electronics talks about challenges in the IoT world and how Arrow is facing those through the Sensor to Sunset approach. Over the lifecycle of the connected ...
AAEON is moving from creating the simple hardware to creating the great solutions within Artificial Intelligence and IoT. AAEON is offering the new solutions for emerging markets, like robotics, drone...
Amir Sherman, Director of Engineering Solutions & Embedded Technology at Arrow Electronics talks about the transition started couple of years ago from a components’ distributor to Technology...
David Spragg, VP, Engineering – EMEA at Arrow Electronics talks about improvements in software and hardware enabling to utilize the AI capabilities. David shares how Arrow with its solutions is ...
In this video Robert Green from ASIC Design Services describes their Core Deep Learning (CDL) framework for FPGA design at electronica 2018 in Munich, Germany. CDL technology accelerates Convolutional...
In this video Caesar from Microchip talks about the company's latest smart home solutions at electronica 2018 in Munich, Germany. One demonstrator shown highlights the convenience and functionalit...
In this video Infineon talks about their new CoolGaN 600 V e-mode HEMTs and GaN EiceDRIVER ICs, offering a higher power density enabling smaller and lighter designs, lower overall system cost. The nor...
In this video Frederik Dostal from Analog Devices explains a very high-efficiency charge-pump demonstration at their boot at electronica 2018 in Munich, Germany. Able to achieve an operating efficienc...